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Our Mission

Advanced Heat Transfer and Thermal Management Solutions

Our heat transfer technologies and thermal management solutions can find wide use in industries such as in information and telecommunication (e.g., mobile phones, base stations, data centers, computers and servers), transportation (e.g., new energy vehicles, charging stations), electronic power (e.g., energy storage, photovoltaics, inverters) and high-power devices (e.g., lasers, power supplies).

R & D strength

NEWS

High efficiency thermal management systems help the green development

2023-03

Fluentrop technology helps green and sustainable development

On March 10, the Green Sustainable Development Forum, jointly sponsored by the Foreign Affairs Office of the Shenzhen Municipal people's Government, the Shenzhen-Hong Kong Collaborative Innovation Research Institute of the Hong Kong University of Science and Technology and Ruian Xintiandi, was successfully held.

2023-02

Fluentrop Technology Enters New Energy Battery PACK Thermal Management System

On February 8, 2023, Shenzhen Shun Entropy Technology Co., Ltd. and Aerospace Lithium Technology (Jiangsu) Co., Ltd. signed a strategic cooperation agreement at the Gaoyou Aerospace Lithium Industry Base, and signed an intention contract of tens of millions of yuan on the spot.

2022-10

IQE announces strategic cooperation agreement with SK siltron

• Based on IQE's powerful gallium nitride innovations • Industry leaders form partnerships with a focus on Asian market growth IQE plc(AIM stock code: IQE, hereinafter referred to as "IQE" or "Group"), the world's leading supplier of compound semiconductor wafer products and advanced material solutions, recently officially announced that it has reached a strategic cooperation agreement with SK siltron, focusing on compound semiconductor Product development and commercialization. SK siltron innovatively introduces the next generation of semiconductor equipment based on world-class technology. Combining SK siltron's substrate expertise and IQE's market-leading outreach capabilities, this partnership formalizes a strategic focus for growing our business in the Asian market. IQE and SK siltron will focus on the development and supply of silicon carbide-based (SiC) gallium nitride (GaN) innovative epitaxial wafers for RF applications in the wireless communications market, as well as silicon-based gallium nitride (Si) applications in a range of markets. These GaN device markets can total billions of dollars and are expected to have strong growth in consumer, telecom and automotive applications.

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ABOUT US

30 Years

R&D Experinece in Thero-fluids

R&D and Production Bases

50 Items

Patent and Trademarks

20 +Pluse

Professional R&D Team

Advanced heat transfer technologies and thermal man-agement systems

Shenzhen Fluentrop Technology Co., Ltd, is a company specializing in developing and manufacturing advanced heat transfer technologies and thermal management solutions for our valued customers. The applications span multiple in dustries including electronics, renewable energy, energy storage, manufacturing and so on. The core technologies are based on our developed wicking materials and fluid flow designs. Our company has R&D and manufacturing facilities in Shenzhen, Dongguang, Gaoyou and Mianyang. With our team of experts, including world-renowned scientists in thermo-fluids, manufacturing, materials and marketing, we can deliver best outcomes for our valued customers.

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PRODUCTS

Fluentrop Technology has a suite of heat transfer products and thermal management systems. Most of the products are based our developed novel materials and flow structures to achieve unparalleled single phase or two-phase flow transport, thereby achieving unprecedented heat transfer performance.

With the ultrafine porous materials and XyleMat materials, our regular VCs can be tailored to meet our customer's heat transfer requirements with unprecedented performance.

Regular VC

Thin VC

XyleMat material based thin Vapor chambers (or VCs )have a total thickness between 0.2~0.5mm, with alength over 200 mm and cooling area over 6000mm2 The temperature difference is within 2~3°C

VC Modules

Our VC modules are packed in much smaller sizes owing to our advanced materials and can be used for both air and liquid cooling, with unprecedented cooling power up to 10,000w. Our aluminum VCs are light-weight and durable and can be tailored to our customers' needs with different operating conditions, including conditions such as low temperature (below -40°C) and/or long distance (over 2 meters) heat distribution.

3D VC

Our 3D VCs allow heat transfer in three dimensions which fill the gap that the traditional VC or heat pipe modules cannot fill. With the 3D VCs or modules, we can offer high efficiency heattransfer solutions for complex geometry situations.

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3D VC

Aluminum alloy VC

Aluminum alloy VC module has the characteristics of lightweight, low-cost structure, high strength, and good oxidation resistance. It can be customized according to different application scenarios of customers, including ultra-low temperature (less than-40C) and long-distance heat transfer (more than 2 meters), etc.

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Aluminum alloy VC

VC and liquid cooling combinations

In combination with liquid cooling techniques commonly used in industry, our VC technology can offer high efficiency cooling with unprecedented power of over 6000w. It can be used for ultrahigh power cooling applications.

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VC and liquid cooling combinations

Thermal management for new energy applications

We offer technology solutions to new energy applications such as thermal management for battery packs in energy storage, cars, trucks and so on. Our advanced heat transfer technology allows heat transfer or distribution over long distance (over 2 meters) and large area (over 3 square meters) with minimal temperature difference.helping our partners to develop next generation electrical vehicles.

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Thermal management for new energy applications

APPLICATION

Applications include consumer electronics, new energy storage, electronic power, chips, advanced manufacturing and many other industries.

Consumer Electronics

In the field of consumer electronics, with the increase of the operating power of smart devices, the traditional single heat dissipation scheme can no longer meet the diversified heat dissipation requirements of high-performance products. The emergence of new thermal materials, so that the electronic equipment cooling scheme to further expand, cooling scheme gradually evolved into a variety of materials "collaborative operation, side by side" cooling mode. In the 5G era, graphite thermal film, as the basic thermal material, can be used with high-efficiency thermal materials such as heat pipes, average temperature plates, graphene thermal films, etc., to play a huge advantage in the high-end smart device market, and continue to penetrate into low-end smart devices.

New energy vehicle

The thermal management system of new energy vehicles mainly includes battery pack environment, power electrical components, motor heat dissipation, automobile air conditioning, etc. The most important of these are the air conditioning system and the battery thermal management system. The battery system of new energy vehicles has stricter requirements for the temperature of the working environment. Excessive or low ambient temperature will significantly affect the vehicle's cruising range and battery life.

Energy storage

With the gradual increase in the proportion of clean energy, energy storage plays a vital role in the generation side, grid side and user side of the power system. Due to the advantages of high energy density, flexible application and fast response, the permeability of electrochemical energy storage increases rapidly. According to CNESA data, as of the end of 2021, the world has been put into operation power storage projects cumulative installed scale of 209 GW, the cumulative installed scale of new energy storage is 25.4GW, sodium ion batteries dominate, market share of more than 90% to 23.1GW. The cumulative installed capacity of power storage projects in China is 46.1GW, accounting for 22% of the total global market size. As the core component of electrochemical energy storage, battery has a great risk of thermal runaway. From the perspective of safety, the thermal management of energy storage is very important.

Semiconductor heat dissipation

With the rapid development of semiconductor technology, the performance of power devices needs to be continuously improved to meet the requirements of the new generation of electronic products for high frequency and high power devices. Power devices based on the new generation of semiconductor material gallium nitride (GaN) have significant advantages such as high frequency, ultra-wideband and high output power, and have broad application prospects in the future communication field. However, the device will generate heat when working at high power. With the continuous accumulation of heat, the temperature of the chip will rise, resulting in a significant attenuation of the output power of the device, which cannot give full play to the performance of the device. Efficient heat dissipation technology at the chip level has therefore become a research hotspot in the semiconductor field.

Data Centers

Data centers are becoming more and more "hot" in China ". On the one hand, 5G is gradually moving towards large-scale commercial use, and the data center, as the carrier of data processing equipment, has undertaken a huge amount of business needs. On the other hand, the data center is included in the national "new infrastructure" strategic category, has become an important part of the national information infrastructure construction, but also the construction of the "economic double cycle" pattern of the key support. In the next few years, the power density of single cabinet in mainstream new data centers may be further improved. Promoting the research and development of data center projects has very important social and economic benefits for data center energy conservation and emission reduction.

COMPETITIVE ADVANTAGES

Production Strength R&D Strength Core Technology Quality Assurance

Production strength

The company has set up three production bases in Dongguan, Guangdong, Gaoyou, Jiangsu and Mianyang, Sichan. Our team is led by world-famous scientists. The team members have rich experience in thermo-fluids, manufacturing, material research and development and marketing, and are committed to providing customers with best products and solutions.

● Dongguan Production Base, Guangdong, established in August 2022

● Gaoyou Production Base, Jiangsu, established in February 2023

● Mianyang Manufacturing Hub, Sichuan, established in September 2023

R&D Strength

With our team of experts, including world-renowned scientists in thermo-fluids, manufacturing, materials and marketing, we can deliver best outcomes to our valued customers.

Core Technology

Fluentrop's core technologies are based on our developed novel wicking materials XyleMat® and microporous metals HiPoreMat®. The development of XyleMat® materials is in spired by water transport mechanism of tall trees against gravity. XyleMat® mimics the xylem structure of trees which can provide both high capillary force and high flow rate and allows efficient transport of working medium over long distance even under gravity, achieving wicking performance unmatched by othermaterials.The microporous metallic material HiPoreMat is fabricated using scalable templating methods. This material has a pore size in the order of 20-80 micrometers and a porosity up to over 90%. Together with our novel fluid flow designs, these materials allow us to develop heat transfer device with unprecedented low thermal resistance.

Quality Assurance

The company has passed the ISO9001 quality system certification, and the IATF 16949 quality system is under review. The production and manufacturing are led by a team of more than 10 years in the industry. The team members have served as the leading enterprises in the domestic well-known heat dissipation industry. They have rich experience and strong ability in product design, process management, quality control and other aspects to ensure the on-time delivery and quality of products.

Shenzhen Fluentrop Technology Co., Ltd

Shenzhen Headquarters: Room 1208, Building 3, Nantai Yunchuang Valley, Tangwei Community, Fenghuang Street, Guangming District, Shenzhen, Guangdong, China

Dongguan Base: 3rd Floor, Unit B, Guancheng Sanliang Wisdom Industrial Park, No. 19 Chuangxing Road, Xingguang Village, Huangjiang Town, Dongguan, Guangdong, China

Gaoyou Base: No.8, Tangbei Road, Gaoyou Economic Development Zone, Yangzhou, Jiangsu, China

Mianyang Base: Zhongmian Road, Youxian District, Mianyang, Sichuan, China

Tel: +86 755 61008594 、+86 18122811423

Email: shunshang@shunshangkeji.com